Wire Bounder
Wire Bounder
Key Features:
- Bonding Modes: Ball bonding, wedge bonding
- Wire / Ribbon Types & Sizes: Wire: 17 µm to 75 µm (Au, Al)
- Axes / Movement: Motorised Z- and Y-axes for the bond tool. X-axis usually manual.
- Touch / Height Control: Automatic bond height adjustment via a Z-axis sensor (touch-down sensing).
- Loop Profile Programming: Able to program loop profiles (up to ~10 steps) so loops are repeatable and adjustable.
- Recipe / Parameter Storage: Can store many bonding parameter sets/recipes (roughly 100).
- User Interface: 6.5-inch TFT touch panel for controlling parameters, selecting mode, etc.
- Heated Work Stage: Heated work stage available (often up to ~250°C) for temperature-sensitive bonding. Vacuum or mechanical clamping options.
- Wire Clamp & Spool Motorization: Motorized wire clamp (for tail-length control) and wire spool motorization for feed consistency.
- Microscope / Alignment: Built-in stereo microscope (zoom) and options like laser spotlight/target system to assist alignment.
