Maskless Lithography
Maskless Lithography
Key Features:
- Maskless Patterning: Eliminates the need for costly chrome masks. Patterns are directly written from a digital design file.
- High Flexibility: Easy design changes (just update the file). Ideal for R&D, prototyping, and low-volume fabrication.
- Resolution & Feature Size: Typical resolution: ~0.5 µm to few µm.
- Substrate Versatility: Works on wafers, glass, polymers, MEMS substrates, flexible materials. Compatible with various positive and negative photoresists.
- Automation & Alignment: Computer-controlled stage with automatic alignment marks recognition. Can do multi-layer lithography with high alignment accuracy (~±0.5 µm or better).
- Pattern Complexity: Can generate arbitrary complex geometries, grayscale lithography, 3D microstructures, and micro-optical elements.
- Software Integration: Supports direct import of GDSII, DXF, Gerber, STL files. Real-time pattern editing and parameter control.
- Non-Vacuum Process: Operates under ambient or cleanroom conditions (no vacuum chamber needed).
- Applications: Semiconductor prototyping, MEMS, photonic devices, diffractive optics. Microfluidics, biochips, polymer devices. R&D.
